Laser Micro Drilling System forms fine holes for various materials such as polyimide tape, glass and others. This process is the laser annealing technic on local position and is adopted in mass production for electronic device. We have been developing optics systems and work positioning control systems for laser process to meet industrial request.
 

Features

  • Microdrilling as small as 4μm
  • Laser scribing and patterning
  • Laser annealing

Specification

Laser Excimer Laser
Wavelength 248nm
Beam size 4mm x 2mm
Maximum energy density 1.6J/cm2
Beam scan XY stage