Diaphragm type vacuum laminator

MVLP500/600-ⅡW
MVLPα500/600
MVLP300/300-S

This system laminates film on the whole surface of the products in vacuum conditions;it inflates an elastic rubber diaphragm to achieve highly conformable and adhesive optimum lamination thanks to elasticity and air pressure.

Two fabrication sizes are available;
large format 500mm x 600mm, suitable for mass production, and 300mm x 300mm, suitable for research and development.
The large format includes a 1 stage type with only the diaphragm and a 2 stage type which is also eqiupped with a flat press.
The high-precision flat press following uniform lamination in the first stage achieves even greater flatness.

Each model has been assigned to flexible print circuit board processes, build-up circuit board processes, and other processes by a number of customers.
In addition, recently some are being used for new technology such as FOWLP.

Features

Vacuum technology

We have many years of technology and know-how, such as a structure for vacuuming the chamber and a sealing mechanism.
Please consult about vacuuming of the whole device or part of it.

 

Example)

MVLP vacuum and pressurized process

  • The vacuum chamber consists of upper and lower heat plates; both include a heater inside.
  • Once the workpiece is fed to the heat plates, these close (to form the chamber); the inside of the chamber becomes the vacumm sate.
  • After the prescribed time elapses, compressed air is supplied to inflate the diaphragm which pushes the workpiece toward the heat plate.
    This pressure force and heat provide bonding.
Vacuum process
Vacuum process

  

Pressurized process
Pressurized process

  

Vacuum lamination technology

Vacuum lamination technology has become indispensable in the field of integrated circuit boards.
We will cooperate in new product development with advice based on years of know-how and experience.

Conventional roller type
Conventional roller type

  

Meiki's “MVLP”
Meiki's “MVLP”