Laminator
Mobility
Information Communication & Electronics
Life & Home Appliance
This equipment laminates specific resin film on the Print Circuit Board (PCB) under high-vacuum condition.
Laminating uniformity and film adhesion would be precisely performed with special rubber Diaphragm.
When you hear the word "laminator," you generally think of a device that applies a film to the surface of an object you want to protect, such as an important document or card. Our laminators basically do the same thing.
The same operation of "heating" and "pressing" is performed. The major difference is that in the preliminary stage, a vacuum is created and a soft rubber sheet called a "diaphragm" is used to apply pressure.
This device removes the air between the objects to be laminated, inflates and presses a soft rubber sheet against them like a balloon, and uses its elasticity and air pressure to achieve optimal lamination with high tracking and adhesive properties.
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- Diaphragm type with excellent tracking performance
- Maximum diaphragm pressure is 1.0 MPa
- Can be heated from above and below in a vacuum
- Special vacuum chamber structure maintains a high vacuum
- The lineup includes
1-stage type with laminating function
2-stage type with flattening function
3-stage type for high-end package substrates - The following materials are supported
Photosensitive coverlay film
Solder resist dry film
Interlayer insulation film
Various insulating films, sealing sheets, etc.
Vacuum and Pressurize Process
- The vacuum chamber consists of upper and lower hot platens, each with a built-in heater.
- When the product is placed in the hot platens, the platens are closed (chamber formation) and a vacuum is drawn inside.
- After a set period of time, compressed air is supplied to expand the diaphragm, which presses the product against the heat plate. This pressing force and heat are used to perform the crimping process.
Vacuum chamber structure
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Vacuum Process -
Pressurization Process
Vacuum Lamination Technology
Vacuum lamination technology is indispensable in the field of semiconductor manufacturing.
We can provide advice based on our many years of know-how and experience, and also cooperate in the development of new products.-
Bubbles and wrinkles are generated by local and linear forces.
< Conventional roller type > -
Good bonding with even force over a wide area under vacuum is possible.
< JSW (diaphragm method) >
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Applications
- Research and development
Applications
- Printed circuit boards, SAW filters, etc.
Applications
- Package substrates, etc.
