“StiFloat™” is our unique technology of handling substrates, developed to meet market demand on manufacturing process.

This technology can make various performances of the system upgraded.

  1. Stable laser scanning process: upgraded uniform velocity on substrate transfer
  2. Wider process margin: upgraded substrate flatness at process area.
  3. Stable successive processing system: sequential laser irradiation to substrate for long-term
  4. Mura reduction: weakened N2 flow and V/C suction mura
  5. Lower ESD
  6. Lower Particle: preventing particles from attaching to the rear side on substrates.