“StiFloat™” is our unique technology of handling substrates, developed to meet market demand on manufacturing process.
This technology can make various performances of the system upgraded.
- Stable laser scanning process: upgraded uniform velocity on substrate transfer
- Wider process margin: upgraded substrate flatness at process area.
- Stable successive processing system: sequential laser irradiation to substrate for long-term
- Mura reduction: weakened N2 flow and V/C suction mura
- Lower ESD
- Lower Particle: preventing particles from attaching to the rear side on substrates.
